Product Description
MODEL 170 Ultrasonic Disk Cutter
Creates disk, cylindrical, and rectangular specimens; disk specimens from materials as thin as 10 μm, rods up to 10 mm long, and rectangular wafers for TEM cross-section (XTEM) specimens.
Creates disk, cylindrical, and rectangular specimens; disk specimens from materials as thin as 10 μm, rods up to 10 mm long, and rectangular wafers for TEM cross-section (XTEM) specimens.
Creates disk, cylindrical, and rectangular specimens; disk specimens from materials as thin as 10 μm, rods up to 10 mm long, and rectangular wafers for TEM cross-section (XTEM) specimens.